Recent progress in quantum photonic chips for quantum communication and internet
Последние достижения в области квантовых фотонных чипов для квантовой связи и квантового интернета
2023-07-13
SCID: 54.1/247zx2av
Discuss with AI
integrated quantum networksphotonic integrated fabrication platformsquantum key distribution (QKD)quantum photonic chipsquantum teleportation
Figures from the paper
Abstract (AI)
Recent years have witnessed significant progress in quantum communication and quantum internet with the emerging quantum photonic chips, whose characteristics of scalability, stability, and low cost, flourish and open up new possibilities in miniaturized footprints. Here, we provide an overview of the advances in quantum photonic chips for quantum communication, beginning with a summary of the prevalent photonic integrated fabrication platforms and key components for integrated quantum communication systems. We then discuss a range of quantum communication applications, such as quantum key distribution and quantum teleportation. Finally, the review culminates with a perspective on challenges towards high-performance chip-based quantum communication, as well as a glimpse into future opportunities for integrated quantum networks.
Key Findings
1
Quantum photonic chips have been applied to quantum communication tasks including quantum key distribution and quantum teleportation.
2
Quantum photonic chips offer scalability, stability, and low cost, enabling miniaturized quantum communication devices.
3
Significant progress has been made toward chip-based quantum communication, but challenges remain for achieving high-performance integrated systems.
4
The paper summarizes prevalent photonic integrated fabrication platforms and key components essential for integrated quantum communication systems.
5
The review identifies future opportunities for integrated quantum networks enabled by advances in photonic chip technology.
Research Object
Quantum photonic chips for quantum communication and quantum internet
Research Subject
Advances, components, fabrication platforms, scalability/stability/cost characteristics, applications (e.g., QKD, quantum teleportation), and challenges towards high-performance chip-based quantum communication and integrated quantum networks
Publication Details
Publication Date
2023-07-13
Journal
Publisher
ISSN
Cited by
278
Open access PDF
Access Type
Author Information
Download PDF
Subscribe to digest