Roadmapping the next generation of silicon photonics

Прокладывая путь к следующему поколению кремниевой фотоники
John E. Bowers, Wim Bogaerts, Lukas Chrostowski, Bhavin J. Shastri, Sudip Shekhar, Richard Soref, Michael Hochberg
2024-01-25

CMOS-foundry-compatible devicesintegrated photonic circuitsoptical communicationsphotonic integration and packagingsilicon photonics
Silicon photonics has developed into a mainstream technology driven by advances in optical communications. The current generation has led to a proliferation of integrated photonic devices from thousands to millions-mainly in the form of communication transceivers for data centers. Products in many exciting applications, such as sensing and computing, are around the corner. What will it take to increase the proliferation of silicon photonics from millions to billions of units shipped? What will the next generation of silicon photonics look like? What are the common threads in the integration and fabrication bottlenecks that silicon photonic applications face, and which emerging technologies can solve them? This perspective article is an attempt to answer such questions. We chart the generational trends in silicon photonics technology, drawing parallels from the generational definitions of CMOS technology. We identify the crucial challenges that must be solved to make giant strides in CMOS-foundry-compatible devices, circuits, integration, and packaging. We identify challenges critical to the next generation of systems and applications-in communication, signal processing, and sensing. By identifying and summarizing such challenges and opportunities, we aim to stimulate further research on devices, circuits, and systems for the silicon photonics ecosystem.
1
Future progress requires addressing system-level challenges across communications, signal processing, and sensing, while leveraging emerging technologies to overcome integration and fabrication bottlenecks.
2
Major barriers to the next generation include CMOS-foundry-compatible device, circuit, integration, and packaging challenges.
3
Sensing and computing applications are approaching commercialization, creating opportunities to expand silicon photonics deployment from millions to billions of shipped units.
4
Silicon photonics has become mainstream through optical communications, with integrated-device deployment expanding from thousands to millions of units, primarily in data-center transceivers.
5
The article maps silicon photonics technology generations using generational definitions analogous to those established for CMOS technology.

next-generation silicon photonics technology and its ecosystem of devices, circuits, integration, packaging, systems, and applications

generational trends, integration and fabrication bottlenecks, and emerging technologies needed to scale silicon photonics from millions to billions of units across communication, signal-processing, and sensing applications

Publication Details
Publication Date
2024-01-25
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Authors
John E. Bowers
Wim Bogaerts
Lukas Chrostowski
Bhavin J. Shastri
Sudip Shekhar
Richard Soref
Michael Hochberg
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