Material science and device physics in SiC technology for high-voltage power devices

Материаловедение и физика приборов в технологии SiC для высоковольтных силовых приборов
Tsunenobu Kimoto
2015-03-23

Schottky barrier diodesdefect electronicspower MOSFETssilicon carbide (SiC)wide-bandgap semiconductors
Power semiconductor devices are key components in power conversion systems. Silicon carbide (SiC) has received increasing attention as a wide-bandgap semiconductor suitable for high-voltage and low-loss power devices. Through recent progress in the crystal growth and process technology of SiC, the production of medium-voltage (600–1700 V) SiC Schottky barrier diodes (SBDs) and power metal–oxide–semiconductor field-effect transistors (MOSFETs) has started. However, basic understanding of the material properties, defect electronics, and the reliability of SiC devices is still poor. In this review paper, the features and present status of SiC power devices are briefly described. Then, several important aspects of the material science and device physics of SiC, such as impurity doping, extended and point defects, and the impact of such defects on device performance and reliability, are reviewed. Fundamental issues regarding SiC SBDs and power MOSFETs are also discussed.
1
Advances in SiC crystal growth and processing have enabled production of 600–1700 V Schottky barrier diodes and power MOSFETs.
2
Fundamental material and device-physics issues remain for both SiC Schottky barrier diodes and power MOSFETs.
3
Impurity doping, point defects, and extended defects substantially influence SiC device performance and reliability.
4
Silicon carbide is identified as a promising wide-bandgap semiconductor for high-voltage, low-loss power devices.
5
The material properties, defect electronics, and reliability mechanisms of SiC power devices remain insufficiently understood.

SiC high-voltage power semiconductor devices, specifically Schottky barrier diodes and power MOSFETs

Material properties, impurity doping, defect electronics, and the effects of extended and point defects on device performance and reliability

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2015-03-23
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Tsunenobu Kimoto
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