Effects of The Laser Wavelength on Drilling Process of Ceramic Using Nd:YAG Laser
Влияние длины волны лазера на процесс сверления керамики с использованием лазера Nd:YAG
2009-08-01
SCID: 54.1/az974bw2
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Nd:YAG laseralumina ceramicambient pressurelaser micro-drillinglaser wavelength
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Abstract (AI)
Laser micro-processing is an enabling technology that facilitates component miniaturization and improved performance characteristics.Alumina ceramic is used in microelectronics in printed circuit fabrication, due to its good dielectric property.Ablation is usually a combination of evaporation and melts expulsion.Material processing with laser is favour because it provides non-contact, low heat input precise method for the formation of small holes with low taper and smooth wall structure.In this study, we report the results of the micro drilling application of alumina ceramic using nanosecond laser for different wavelengths (532 nm and 355 nm) in vacuum and atmosphere environment.The effects of power, wavelength and ambient pressure on crater structure were examined.
Key Findings
1
Drilling experiments compared vacuum and atmospheric environments to assess their influence on alumina processing.
2
Laser ablation of alumina was characterized as a combination of material evaporation and melt expulsion.
3
Nanosecond Nd:YAG laser microdrilling was applied to alumina ceramic using 532 nm and 355 nm wavelengths.
4
The study examined how laser power, wavelength, and ambient pressure affect the resulting crater structure.
5
The work targets precise formation of small, low-taper holes with smooth walls for alumina-based microelectronics components.
Research Object
Alumina ceramic subjected to nanosecond Nd:YAG laser micro-drilling
Research Subject
Effects of laser power, wavelength (532 nm and 355 nm), and ambient pressure (vacuum and atmosphere) on crater structure during micro-drilling
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2009-08-01
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