Enhanced Pool Boiling via Binder-Jetting 3D-Printed Porous Copper Structures: CHF and HTC Investigation

Интенсификация кипения в большом объёме с помощью пористых медных структур, напечатанных методом 3D-печати Binder Jetting: исследование критического теплового потока и коэффициента теплоотдачи
Lilian Aketch Okwiri, Takeshi Mochizuki, Kairi Koito, Noriaki Fukui, Koji Enoki
2025-07-15

binder jetting 3D printingcapillary rewettingcritical heat fluxpool boiling heat transferporous copper structures
The escalating heat flux densities in high-performance electronics necessitate superior thermal management. This study enhanced pool-boiling heat transfer, a method offering high heat removal capacity, by leveraging Binder Jetting 3D Printing (BJ3DP) to create complex porous copper structures without the need for chemical treatments. This approach enables a reliable utilization of phenomena like capillarity for improved performance. Three types of porous copper structures, namely Large Lattice, Small Lattice, and Staggered, were fabricated on pure copper substrates and tested via pool boiling of de-ionized and de-gassed water at atmospheric pressure. Compared to a plain polished copper surface, which exhibited a critical heat flux (CHF) of 782 kW/m2 at a wall superheat of 18 K, the 3D-printed porous copper surfaces showed significantly improved heat transfer performance. The Staggered surface achieved a conventional CHF of 2342.4 kW/m2 (a 199.7% enhancement) at a wall superheat of 24.6 K. Notably, the Large Lattice and Small Lattice structures demonstrated exceptionally stable boiling without reaching the typical catastrophic CHF within the experimental parameters. These geometries continued to increase in heat flux, reaching maximums of 2397.7 kW/m2 (206.8% higher at a wall superheat of 55.6 K) and 2577.2 kW/m2 (229.7% higher at a wall superheat of 39.5 K), respectively. Subsequently, a gradual decline in heat flux was observed with an increasing wall superheat, demonstrating an outstanding resistance to the boiling crisis. These improvements are attributed to the formation of distinct vapor–liquid pathways within the porous structures, which promotes the efficient rewetting of the heated surface through capillary action. This mechanism supports a highly efficient, self-sustaining boiling configuration, emphasizing the superior rewetting and vapor management capabilities of these 3D-printed porous structures, which extend the boundaries of sustained high heat flux performance. The porous surfaces also demonstrated a higher heat transfer coefficient (HTC), particularly at lower heat fluxes (≤750 kW/m2). High-speed digital camera visualization provided further insight into the boiling phenomenon. Overall, the findings demonstrate that these BJ3DP structured surfaces produce optimized vapor–liquid pathways and capillary-enhanced rewetting, offering significantly superior heat transfer performance compared to smooth surfaces and highlighting their potential for advanced thermal management.
1
Binder Jetting 3D printing produced complex porous copper boiling surfaces without chemical treatment, enabling capillarity-based thermal enhancement.
2
Distinct vapor–liquid pathways promoted capillary rewetting and vapor management, producing stable boiling and strong resistance to boiling crisis.
3
Large Lattice and Small Lattice surfaces did not reach catastrophic CHF within testing, instead reaching maximum heat fluxes of 2397.7 and 2577.2 kW/m².
4
Relative to polished copper, these maxima corresponded to enhancements of 206.8% for Large Lattice and 229.7% for Small Lattice.
5
The Staggered structure reached a conventional CHF of 2342.4 kW/m² at 24.6 K wall superheat, representing a 199.7% improvement over polished copper.

Binder-Jetting 3D-printed porous copper structures on pure copper substrates during pool boiling of de-ionized, de-gassed water at atmospheric pressure

Pool-boiling heat-transfer performance, including critical heat flux, heat-transfer coefficient, boiling stability, and surface rewetting enabled by capillary-driven vapor–liquid pathways

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2025-07-15
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Lilian Aketch Okwiri
Takeshi Mochizuki
Kairi Koito
Noriaki Fukui
Koji Enoki
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