Offset masks for lift-off photoprocessing

G. J. Dolan
1977-09-01

oblique angle thin-film depositionoffset maskssingle-mask lift-off processingsmall-area Josephson junctionssubmicron-scale thin-film structures
We describe a technique using photolithography to produce submicron-scale thin-film structures and simple multilevel structures by single-mask lift-off processing. The technique employs masks offset from the substrate and oblique angle thin-film deposition. It provides a simple means of making small-area Josephson junctions and varying-thickness superconducting bridges and is suitable for the inclusion of these devices in circuits. The examples we show emphasize such applications in superconductivity; however, the technique may find uses in other fields as well.
1
A photolithography technique using masks offset from the substrate enables submicron-scale thin-film structures via single-mask lift-off processing.
2
Oblique-angle thin-film deposition combined with offset masks allows creation of simple multilevel structures and varying-thickness superconducting bridges.
3
Technique emphasizes applications in superconductivity but is potentially applicable to other fields as well.
4
The method provides a straightforward way to fabricate small-area Josephson junctions suitable for integration into circuits.

Offset photolithography masks and oblique-angle thin-film deposition setup for single-mask lift-off processing

Fabrication of submicron-scale thin-film and simple multilevel structures (including small-area Josephson junctions and varying-thickness superconducting bridges) via single-mask lift-off using offset masks and oblique-angle deposition

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1977-09-01
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G. J. Dolan
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