Carbon Nanoparticle-Based Electro-Thermal Building Block
Электротермический строительный блок на основе углеродных наночастиц
2020-07-25
SCID: 54.1/hv688su9
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arc discharge synthesisback-to-back Schottky diodescarbon nanoparticleselectro-thermal building blockmetal–semiconductor–metal (MSM) structure
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Abstract (AI)
All around the world, researchers have raised concerns about the superlative geometrical, electronic, thermal, chemical and mechanical properties of carbon nanoparticles (CNPs). CNPs with low cost, high performance and prominent intrinsic properties have attracted extensive interest for numerous applications in various fields. Although CNPs have been studied mainly as transistors and sensors, they could also be considered as heat producers. However, this option has scarcely been studied. In this research, a CNP-based electro-thermal building block is synthesized by the arc discharge method in a carbonic medium (high-density polyethylene), and its behavior is investigated. It is shaped in the form of a metal–semiconductor–metal structure (MSM) between metallic electrodes, and in addition, the formation of two back-to-back Schottky diodes is analyzed and their use as CNP-based electro-thermal building blocks are reported.
Key Findings
1
Carbon nanoparticles (CNPs) synthesized by arc discharge in high-density polyethylene can function as electro-thermal building blocks.
2
The MSM CNP device exhibits two back-to-back Schottky diodes, whose formation is analyzed in the study.
3
The synthesized CNP material was formed into a metal–semiconductor–metal (MSM) structure between metallic electrodes.
4
The work demonstrates the potential use of CNPs as heat producers (electro-thermal elements), a scarcely studied application compared to transistors and sensors.
Research Object
Carbon nanoparticle (CNP)-based electro-thermal metal–semiconductor–metal (MSM) building block synthesized by arc discharge in a high-density polyethylene carbonic medium
Research Subject
Electrical and electro-thermal behavior of the CNP-based MSM structure, including formation and analysis of back-to-back Schottky diodes and their heat-generation performance
Publication Details
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2020-07-25
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