GaN-based power devices: Physics, reliability, and perspectives
Силовые приборы на основе GaN: физика, надежность и перспективы
2021-11-08
SCID: 54.1/spranw6e
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AlGaN/GaN heterostructuresGaN-based power devicestrapping and reliabilitytwo-dimensional electron gasvertical GaN transistors
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Abstract (AI)
Over the last decade, gallium nitride (GaN) has emerged as an excellent material for the fabrication of power devices. Among the semiconductors for which power devices are already available in the market, GaN has the widest energy gap, the largest critical field, and the highest saturation velocity, thus representing an excellent material for the fabrication of high-speed/high-voltage components. The presence of spontaneous and piezoelectric polarization allows us to create a two-dimensional electron gas, with high mobility and large channel density, in the absence of any doping, thanks to the use of AlGaN/GaN heterostructures. This contributes to minimize resistive losses; at the same time, for GaN transistors, switching losses are very low, thanks to the small parasitic capacitances and switching charges. Device scaling and monolithic integration enable a high-frequency operation, with consequent advantages in terms of miniaturization. For high power/high-voltage operation, vertical device architectures are being proposed and investigated, and three-dimensional structures—fin-shaped, trench-structured, nanowire-based—are demonstrating great potential. Contrary to Si, GaN is a relatively young material: trapping and degradation processes must be understood and described in detail, with the aim of optimizing device stability and reliability. This Tutorial describes the physics, technology, and reliability of GaN-based power devices: in the first part of the article, starting from a discussion of the main properties of the material, the characteristics of lateral and vertical GaN transistors are discussed in detail to provide guidance in this complex and interesting field. The second part of the paper focuses on trapping and reliability aspects: the physical origin of traps in GaN and the main degradation mechanisms are discussed in detail. The wide set of referenced papers and the insight into the most relevant aspects gives the reader a comprehensive overview on the present and next-generation GaN electronics.
Key Findings
1
AlGaN/GaN polarization-induced two-dimensional electron gases provide high mobility and channel density without intentional doping, reducing resistive losses.
2
GaN offers exceptional power-device properties, combining the widest energy gap, largest critical field, and highest saturation velocity among commercially available power-device semiconductors.
3
GaN transistors achieve very low switching losses because of small parasitic capacitances and switching charges, while scaling and monolithic integration support high-frequency miniaturization.
4
Trapping and degradation are central reliability challenges in GaN; understanding trap origins and degradation mechanisms is necessary to improve device stability and reliability.
5
Vertical and three-dimensional GaN architectures, including fin-shaped, trench-structured, and nanowire-based devices, show strong potential for high-power and high-voltage applications.
Research Object
GaN-based power devices (lateral and vertical GaN transistors and three-dimensional GaN device architectures)
Research Subject
Their underlying physics, device technology, trapping, degradation mechanisms, stability, and reliability
Publication Details
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2021-11-08
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