Recent Developments in Mechanical Ultraprecision Machining for Nano/Micro Device Manufacturing

The production of many components used in MEMS or NEMS devices, especially those with com-plex shapes, requires machining as the best option among manufacturing techniques. Ultraprecision machining is normally employed to achieve the required shapes, dimensional accuracy, or improved surface quality in most of these devices and other areas of application. Compared to conventional machining, ultraprecision machining involves complex phenomenal processes that require extensive investigations for a better understanding of the material removal mechanism. Materials such as semiconductors, composites, steels, ceramics, and polymers are commonly used, particularly in devices designed for harsh environments or applications where alloyed metals may not be suitable. However, unlike alloyed metals, materials like semiconductors (e.g., silicon), ceramics (e.g., silicon carbide), and polymers, which are typically brittle and/or hard, present significant challenges. These challenges include achieving precise surface integrity without post-processing, managing the ductile-brittle transition, and addressing low material removal rates, among others. This review paper examines current research trends in mechanical ultraprecision machining and sustainable ultraprecision machining, along with the adoption of molecular dynamics simulation at the micro and nano scales. The identified challenges are discussed, and potential solutions for addressing these challenges are proposed.