Thermally conductive and electrically insulative alumina/epoxy composites for advanced electronic packaging applications: A comprehensive review of filler morphologies and surface modifications

C.P. Wong, Kyoung‐sik Moon, Zihao Lin, Zhijian Sun, Wenbin Fu, Yu-Chieh Lin
2025-03-29
SCID:  54.1/zy4jm2r2
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2025-03-29
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C.P. Wong
Kyoung‐sik Moon
Zihao Lin
Zhijian Sun
Wenbin Fu
Yu-Chieh Lin
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