Fabrication of a ceramic/metal (Al<sub>2</sub>O<sub>3</sub>/Al) composite by 3D printing as an advanced refractory with enhanced electrical conductivity
Изготовление керамико-металлического композита (Al2O3/Al) методом 3D-печати в качестве продвинутого огнеупора с повышенной электрической проводимостью
2020-01-01
SCID: 54.1/g84neh4j
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3D printingAl2O3/Al compositeelectrical conductivityfused deposition modellingrefractory materials
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Abstract (AI)
several analytical techniques such as scanning electron microscopy, energy dispersive X-ray spectroscopy, X-ray diffraction, compressive testing, hardness testing, XPS, and Hall measurement. Unlike other ceramic printing techniques that require expensive 3D printing machines and a very high temperature furnace (above 1500 °C) for post processing, this study demonstrates the viability of fabricating refractory items using a cost-effective fused deposition modelling 3D printer and a low temperature furnace (900 °C). The samples did not disintegrate at 1400 °C and were still sufficiently electrically conductive for advanced refractory applications.
Key Findings
1
A ceramic/metal (Al2O3/Al) composite refractory was fabricated using fused deposition modelling (FDM) 3D printing.
2
Fabrication used a low-temperature post-processing furnace at 900 °C instead of typical >1500 °C, enabling cost-effective production.
3
Material characterization employed SEM, EDS, XRD, compressive and hardness testing, and XPS to validate structure and properties.
4
Printed samples remained intact (did not disintegrate) after exposure to 1400 °C.
5
The composite exhibited sufficient electrical conductivity for advanced refractory applications, confirmed by Hall measurement and other analyses.
Research Object
3D-printed ceramic/metal (Al2O3/Al) composite refractory samples
Research Subject
Fabrication viability and high-temperature stability plus enhanced electrical conductivity of the Al2O3/Al composite produced by fused deposition modelling and low-temperature (900 °C) sintering for advanced refractory applications
Publication Details
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2020-01-01
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